Measure Temperature and Air Velocity with Candlestick Sensor

September 29, 2011 by  
Filed under Featured, Temperature

Candlestick Sensor from ATS 300x268After sizing a heatsink and fan, system designers may want some data to show the heatsink and fan are doing the job. For these and other characterization of thermal conditions in electronic systems, Advanced Thermal Solutions MS 1000-CS-WC could provide the answer and data they need. The candlestick-shaped sensor has a 0.5 mm in diameter stem and 9.5 mm base diameter to provide minimal intrusion into the system airflow. Heights of 9, 12 and 20 mm are available.

Calibrated for both low, natural convection and high velocity flows, the sensors address temperature measurements ranging from   -30 to +150°C ±1°C and velocity measurements from 0 to 50 m/s (10,000 ft/min) ±2%.

For more information about Advanced Thermal Solutions  MS 1000-CS-WC temperature and air velocity sensor click here.

Flexible Non-Contact Position/Displacement Sensing

September 28, 2011 by  
Filed under Featured, Inductive, Position

cid 7FEC472C E6FF 4D21 9793 7B863FD280A7 239x300Using inductive (eddy current) technology, Kaman’s SMT-9700 system can provide extremely high-resolution, non-contact, position/displacement feedback of electrically conductive targets.

The 13 sensors for the system range in size from 0.5 mm (0.020 inch) to 15.0 mm (0.6 inch) and can detect non-ferrous and ferrous materials.

For original equipment manufacturers (OEMs), Kaman can customize both the electronics packaging and sensor design. For example, it can vary the frequency response, linearity, or a combination of the two to achieve desired system performance. In addition, if thermal stability is critical, the company  can tradeoff linearity and tune the system for thermal stability.

For more information about Kaman’s SMT-9700 position sensing system, click here.

Small Vibration Monitor Delivers Exceptional Low-noise Performance

2757788cADI ADIS16228 App Shot RGB 1860x1860 300dpi en 300x203A vibration monitor can prevent a myriad of problems – if it can fit within the monitored system’s space constraints and has the right performance. For noise sensitive applications with limited space, Analog Devices’ ADIS16228 iSensor vibration monitor could be that solution.

An embedded programmable processor in the MEMS-based vibration analysis system provides directional sensing and spectral analysis to identify and classify specific sources of vibration.

The noise performance of the 3-axis vibration monitor is specified at only 248 µg/ √Hz, across a dynamic range of ±18g, and the unit is configurable to ranges of 0 g to 1 g 0 to 5 g/, 0 to 10 g and 0 to 20 g.

Footprint and pin-for-pin compatible with the ADIS16210, the ADIS16228 has an extended operating temperature range of −40°C to +125°C.

For more information about Analog Devices ADIS16228 vibration monitor, click here.

Sensing Three Axes of Linear and Angular Motion in a 20-mm Footprint

There seems to be an insatiable demand to sense motion in the latest portable electronic products. For those with limited space, STMicroelectronics LSM330DL Micro-Electro-Mechanical Systems (MEMS) sensor could satisfy their requirements. In its 4 x 5 x 1mm plastic land grid array (LGA) package, the 6 degrees-of-freedom (6DoF) inertial MEMS module is almost twice as small as anything else in production according to the company.LSM330DL INERTIAL MODULE HR AIAP p3193big 300x210

The accelerometer portion has a user-selectable full-scale acceleration range from 2 to 16g and the gyroscope portion has angular-rate detection from 250 to 2500 dps along the pitch, roll and yaw axes. The co-packaged sensors provide inherently precise alignment of the two sensors’ reference axes. In addition, the mechanical sensing structure’s design
delivers excellent thermal and mechanical stability. For example, the angular rate sensitivity change vs. temperature
from -40 to +85°C is ±2% (typically) and angular rate sensitivity with a full scale setting of ±250 dps is typically 8.75 mdps/digit.

The 6DoF  sensor is software-compatible with ST’s latest-generation 3-axis digital accelerometers (LIS3DH) and gyroscopes (L3GD20).

For more information about STMicroelectronics LSM330DL inertial module, click here.

Make Numerous Measurements Using Gauge Technology

September 22, 2011 by  
Filed under Featured, Position

Renishaw.imX  300x225Dennis Bobo, an application engineer at Renishaw, explains the use of the SP25 sensor probe in the Equator 300 gauge to Sensor Tips’ Randy Frank at the first Interactive Manufacturing Experience (imX 2011) conference, Sept. 12-14, 2011 in Las Vegas. The sensor senses the direction of movement of the machine so it knows exactly where the probe is.

For more information about the Renishaw Equator 300, click here.

For more information about the Renishaw SP 25M sensor system module, click here.

To watch the video, click here.

RFID Links the Tool Room to the Factory Floor

September 21, 2011 by  
Filed under Featured, Position

Balluff.imX  300x225At the first Interactive Manufacturing Experience (imX 2011) conference, Sept. 12-14, 2011 in Las Vegas, Tom Rosenberg, director of marketing for Balluff explains the company’s Tool ID products that use RFID technology to integrate the tool room with the factory floor to Sensor Tips’ Randy Frank.

For more information about Balluff Tool ID products, click here.

To watch the video, click here.

NIST’s first Chief Manufacturing Officer Kicks off imX 2011

September 17, 2011 by  
Filed under Featured

P1050263 300x225In his first public address as the Chief Manufacturing Officer for NIST at the U.S. Department of Commerce, Michael Molnar spoke to an audience of manufacturing engineers at the first Interactive Manufacturing Experience (imX 2011) conference, Sept. 12-14, 2011 in Las Vegas. In this newly created position, Molnar is NIST’s central point of contact with the White House, the Department of Commerce and other agencies on technical and policy issues related to manufacturing.

“As everybody in manufacturing knows, you can’t do anything if you can’t measure it,” Molnar said.

Molnar explained the many TLA (three-letter acronyms) he has learned in his two weeks on the job associated with the U.S. Advanced Manufacturing Initiative. This included new national Advanced Manufacturing Partnership (AMP) and Technology Innovation Program (TIP). The Advanced Manufacturing Technology (AMTECH) Consortia was established to support R&D in advanced manufacturing and is a key part of AMP. TIP targets the supporting, promoting and accelerating of high-risk research in industry and academia.

 

Molnar solicited input from the attendees and other manufacturing experts regarding how the AMTech Consortia should work. Input is required by Sept. 20, 2011 and accepted
only by email.

To see Molnar’s presentation slides at imX 2011, click here.

Capacitive Sensor for Liquid Level Detection

September 15, 2011 by  
Filed under Capacitive, Featured, Liquid Level

cid AD35DAD6 8229 4BBA 9978 828503EDA6DA 300x233Detecting liquid levels in confined spaces in machines and facilities can pose problems. For these types of applications, Baumer developed its CFDK 25 capacitive sensor. The 52.4 x 25-mm flat housing design has a height of only 6 mm and has an available mounting frame. In addition to attachment with two screws, the frame allows installation with cable ties, a Velcro fastener or glue.

The capacitive sensor has four fixed nominal sensing distances from 2 to 15 mm offered in a chemical resistance housing made of Polyamid 12 plastic.

For further information on Baumer’s CFDK 25 capacitive sensor, click here.

Noncontact Infrared Temperature Sensors with Network Communication Options

September 14, 2011 by  
Filed under Featured, Temperature

9250004 ENG A X 300x199Raytek has simplified connecting noncontact temperature sensing in industrial applications. Its MI3 infrared (IR) sensors are now compatible with the Modbus and Profibus network protocols. Multi-channel noncontact temperature measurements can be made with a range of optical resolutions (2:1, 10:1 or 22:1) and response times as fast as 20 mS. Offered in a temperature range from -40°C to 1650°C , the sensors have a rugged IP65 (NEMA 4) stainless steel sensing head with a separate communication module.

To simplify design, all sensor-operating parameters are easily accessed and configured through the standard user interface with backlit LCD display, or with the Raytek DataTemp multidrop software via the USB 2.0 digital interface.

For more information about Raytek MI3 Noncontact Infrared Temperature Sensors, click here.

Sensor Analog Front-Ends Simplify System Design

September 10, 2011 by  
Filed under Featured, Signal Conditioning

LMP900xx Photo 300 300x200National’s LMP900xx sensor Analog Front-Ends (AFE integrated circuits (ICs) target precision sensing systems used to monitor and control temperature, pressure, load, force, motion/position and voltage inindustrial, medical, and test and measurement applications. For example, the conversion (ADC) and op amps for pressure sensors and op amps and current sources for RTDs.

The LMP900xx family features either a 24-bit or 16-bit sigma-delta ADC with a programmable input (mux) configuration that interfaces up to 4-differential inputs, or 7-single-ended inputs in any combination of input types.

Combined with National’s WEBENCH Sensor AFE Designer software tool and bench-top development system the ICs help designers to complete their system design quickly.

For more information on National’s LMP900xx sensor AFE ICs, click here.

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