Robot Provides Virtual Presence at 2012 CES (Pt 2)

At the 2012 International CES (Consumer Electronics Show) in Las Vegas, Alexandra Dopplinger, a marketing manager at Freescale Semiconductor explains the capability of a remote robot that she controls from her location in Ottawa, Canada. Freescale’s pressure sensors and accelerometers are used in the design of the robot as well as proximity sensors to detect stairs or potential collisions and a camera to view the surroundings in the remote location.

To watch the video, click here.

For more information about VGo products and services, click here.

For more information about Freescale Semiconductor’s acceleration sensors, click here

and pressure sensors, click here.

To link to part 1, click here.

Robot Provides Virtual Presence at 2012 CES (Pt 1)

Ned Semonite, vice president of products at VGo Communications explains the company’s robotic telepresence product at the 2012 International CES (Consumer Electronics Show) in Las Vegas. Freescale’s pressure sensors and accelerometers are used in the design of the robot as well as proximity sensors to detect stairs or potential collisions and a camera to view the surroundings in the remote location.

To watch the video, click here.

For more information about VGo products and services, click here.

For more information about Freescale Semiconductor’s acceleration sensors, click here

and pressure sensors, click here.

Nine-Axis Sensing Enables Games and Augmented Reality

At the 2012 International CES (Consumer Electronics Show) in Las Vegas, Frank Melzer, CEO of Bosch Sensortec demonstrates 9-axis sensing using a combined accelerometer and eCompass magnetometer with the company’s newest 3×3-mm triaxial gyroscope, the BMG160. The 9-degree of freedom sensing combined with an imaging system and additional software enables augmented reality. In addition, Melzer explains the use of a MEMS pressure sensor in a smart phone.

To watch the video, click here.

For more information about Bosch Sensortec MEMS sensors here or

Gyroscope, click here.

To Your Health: 3-Axis Accelerometers and Gyroscopes Provide Feedback

At the 2012 International CES (Consumer Electronics Show) in Las Vegas, Eric Zorich, CEO of Diesel Dogs describes how a three-axis accelerometer and three-axis gyroscope are used to provide a set of Smart Weights. The software in the design allows users to properly exercise and obtain the maximum benefit from a workout. The concept placed as a top 3 finalist in “The 2011 Innovation World Cup” sponsored by the Bluetooth SIG. The MEMS sensors in the company’s demonstration prototype were supplied by Freescale Semiconductor.

To watch the video, click here.

For more information about Diesel Dogs’ Smart Weights, click here.

For more information about Freescale Semiconductor’s three axis accelerometers and three axis gyroscopes, click here.

Nine-Axis MEMS Motion Sensing

At the 2012 International CES (Consumer Electronics Show) in Las Vegas, David Borison of InvenSense demonstrates the capabilities of nine-axis motion sensing using the company’s newly introduced MPU-9150 nine-axis (gyro + accelerometer + compass) MEMS MotionTracking device. The multi-axis sensor incorporates MotionFusion and run-time firmware that simplifies motion sensing in end products. To further simply the design-in process, a development dongle is available.

To watch the video, click here.

For more information about InvenSense MPU-9150, click here.

Accelerometer Helps Archers Hit the Mark

When new products are introduced, manufacturers like to identify other potential applications beyond the one used to drive product development. Mounting an accelerometer on an arrow tip to provide ballistic measurements to evaluate bows probably was not on any accelerometer manufacturer’s list. However, that is what Full Flight Technology does to improve high-performance archery. Using Analog Devices’ ADXL346 3-axis digital accelerometer, Full Flight Technology’s Velocitip Ballistic System continuously measures arrow drag in flight to provide downrange performance data. Instead of being limited to point of impact information, the continuous measurement capability of the arrow-mounted system quickly and easily identifies factors important to improving arrow design and downrange performance.

For more information about ADI’s ADXL346 3-axis digital MEMS (micro-electromechanical systems) accelerometer, click here.

Silicon MEMS Gyro Takes on Fiber Optic Gyros

Mechanical gyroscopes use a top-like mechanism spinning at high speed to detect angular position and provide high precision but at a high price. In contrast, fiber optic gyros (FOG) have minimal moving parts and offer high precision as well with a medium to high-end pricing. Sensonor Technologies’ STIM210 gyro module targets both designs with low bias error over temperature, a bias instability of 0.5⁰/h and low noise of 10⁰/√h. Operating over a temperature range of -40 to +85⁰C, the MEMS-based gyro is insensitive to magnetic fields and has no intrinsic wear-out mechanisms.

For more information about Sensonor Technologies’ STIM210 MEMS gyro module, click here.

Smallest Sensor Week: Dual-Axis Gyroscopes Boast Smallest Packaging

With a 3 x 3 x 0.75-mm form factor, InvenSense Inc. lays claim to the world’s smallest dual-axis gyroscopes. Targeting optical image stabilization (OIS) in smartphones, the IDG-2020 is an x-y (roll and pitch) and the IXZ-2020 is an x-z (roll and yaw) dual-axis MEMS gyroscope.

Features in the gyroscopes designed specifically for OIS requirements include the ability to have a factory full-scale output of ±32 degrees per second (dps) for the highest sensitivity to detect the slightest hand jitter, high-performance 32kHz ADC sampling, a nominal drive frequency of 27kHz that makes the gyroscopes immune to interference from audible frequencies such as music or ambient noise, a high speed 20-MHz SPI serial interface, and more.

For more information about InvenSense IDG-2020 and IXZ-2020 dual-axis gyroscopes, click here.

Smallest Sensor Week: Dual-Axis Digital Accelerometer Boasts Smallest Packaging

The second of this week’s small sensors is the world’s smallest and most robust digital accelerometer from MEMSIC Inc. Using patented MEMS thermal technology manufactured with a standard 0.18 µm CMOS process and advanced wafer- level packaging (WLP), the MXC6226XC two-axis digital accelerometer fits within a 1.2. x 1.7 x 1.0 mm package.  Per the company’s analysis, this makes it approximately 50% smaller than competitive products.

The two-axis digital accelerometer can measure acceleration over a ±2 g range with an absolute  0g offset of less than ±50 mg as well as can detect four orientation positions and provide shake detection. The company’s thermal accelerometer technology uses no moving internal structures, so the accelerometer exhibits extremely high shock survivability (up to 50,000g).

For more information on the MEMSIC MXC6226XC two-axis digital accelerometer,
click here.

Smallest Sensor Week: Smallest 3-Axis Digital Gyroscope

With microelectromechanical system (MEMS) technology and semiconductor packages, sensor manufacturers compete to cram the most technology into the smallest package. This week, Sensor Tips will highlight products that the manufacturer says is the world’s smallest. Without performing the extensive research necessary to verify the claims, we’ll take their word for it. Users can take advantage of these products’ minute size and capabilities to add features and performance to portable electronic products.

The first smallest sensor is STMicroelectronics world’s smallest 3-axis digital gyroscope. Housed in a 3 x 3.5 x 1-mm land grid array (LGA) 16-pin package, the L3G3200D gyroscope provides a 16-bit data output on the interrupt and data-ready lines and it integrates low- and high-pass filters with user-selectable bandwidth. The gyro operates with any supply voltage within the range of 2.4 to 3.6V with selectable full-scale values of ±250/500/2000 dps.

For more information about STMicroelectronics L3G3200D 3-axis digital gyroscope, click here.

Next Page »