Reverse Engineering Process & Costing Analysis of the STMicroelectronics 3-Axis Accelerometer
September 6, 2010 by Randy Frank
Filed under Accelerometer, Featured
Finding out how a particular sensor is constructed can provide some helpful information, especially for a competitor. However, potential users may also want to know more about what is inside a sensor that they are considering – before they decide to purchase it. For STMicroelectronics LIS331DLH 3-Axis Accelerometer, Yole Developpement has just published a reverse engineering process & costing analysis report.
The report includes:
– Detailed photos & material analysis
– Schematic assembly description
– Manufacturing process flow & cost breakdown
– In-depth economical analysis & selling price estimation
Yole also has analysis for other MEMS products fom Bosch Sensortec accelerometer, InvenSense and Epson gyroscopes, Freescale TPMS, Knowles microphone, TI DLP, and more. For more info click here.
For more information about Yole Developpement analysis of the STMicro LIS331DLH 3-Axis Accelerometer, click here.


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