Robot Provides Virtual Presence at 2012 CES (Pt 2)

At the 2012 International CES (Consumer Electronics Show) in Las Vegas, Alexandra Dopplinger, a marketing manager at Freescale Semiconductor explains the capability of a remote robot that she controls from her location in Ottawa, Canada. Freescale’s pressure sensors and accelerometers are used in the design of the robot as well as proximity sensors to detect stairs or potential collisions and a camera to view the surroundings in the remote location.

To watch the video, click here.

For more information about VGo products and services, click here.

For more information about Freescale Semiconductor’s acceleration sensors, click here

and pressure sensors, click here.

To link to part 1, click here.

Nine-Axis Sensing Enables Games and Augmented Reality

At the 2012 International CES (Consumer Electronics Show) in Las Vegas, Frank Melzer, CEO of Bosch Sensortec demonstrates 9-axis sensing using a combined accelerometer and eCompass magnetometer with the company’s newest 3×3-mm triaxial gyroscope, the BMG160. The 9-degree of freedom sensing combined with an imaging system and additional software enables augmented reality. In addition, Melzer explains the use of a MEMS pressure sensor in a smart phone.

To watch the video, click here.

For more information about Bosch Sensortec MEMS sensors here or

Gyroscope, click here.

To Your Health: 3-Axis Accelerometers and Gyroscopes Provide Feedback

At the 2012 International CES (Consumer Electronics Show) in Las Vegas, Eric Zorich, CEO of Diesel Dogs describes how a three-axis accelerometer and three-axis gyroscope are used to provide a set of Smart Weights. The software in the design allows users to properly exercise and obtain the maximum benefit from a workout. The concept placed as a top 3 finalist in “The 2011 Innovation World Cup” sponsored by the Bluetooth SIG. The MEMS sensors in the company’s demonstration prototype were supplied by Freescale Semiconductor.

To watch the video, click here.

For more information about Diesel Dogs’ Smart Weights, click here.

For more information about Freescale Semiconductor’s three axis accelerometers and three axis gyroscopes, click here.

Sensing in an Armband Health Monitor

Nick Wilson of BodyMedia discusses the sensing and capabilities of the company’s two health monitoring devices at the 2012 International CES (Consumer Electronics Show) in Las Vegas.

To watch the video, click here.

For more information about BodyMedia FIT Armbands, click here.

Accelerometer Helps Archers Hit the Mark

When new products are introduced, manufacturers like to identify other potential applications beyond the one used to drive product development. Mounting an accelerometer on an arrow tip to provide ballistic measurements to evaluate bows probably was not on any accelerometer manufacturer’s list. However, that is what Full Flight Technology does to improve high-performance archery. Using Analog Devices’ ADXL346 3-axis digital accelerometer, Full Flight Technology’s Velocitip Ballistic System continuously measures arrow drag in flight to provide downrange performance data. Instead of being limited to point of impact information, the continuous measurement capability of the arrow-mounted system quickly and easily identifies factors important to improving arrow design and downrange performance.

For more information about ADI’s ADXL346 3-axis digital MEMS (micro-electromechanical systems) accelerometer, click here.

Smallest Sensor Week: Dual-Axis Digital Accelerometer Boasts Smallest Packaging

The second of this week’s small sensors is the world’s smallest and most robust digital accelerometer from MEMSIC Inc. Using patented MEMS thermal technology manufactured with a standard 0.18 µm CMOS process and advanced wafer- level packaging (WLP), the MXC6226XC two-axis digital accelerometer fits within a 1.2. x 1.7 x 1.0 mm package.  Per the company’s analysis, this makes it approximately 50% smaller than competitive products.

The two-axis digital accelerometer can measure acceleration over a ±2 g range with an absolute  0g offset of less than ±50 mg as well as can detect four orientation positions and provide shake detection. The company’s thermal accelerometer technology uses no moving internal structures, so the accelerometer exhibits extremely high shock survivability (up to 50,000g).

For more information on the MEMSIC MXC6226XC two-axis digital accelerometer,
click here.

Sense Acceleration with a 2 x 2-mm Package

Sensing acceleration in a space-constrained end product may result in the tradeoff of another feature if the accelerometer takes too much space. To avoid the conflict, STMicroelectronics introduced three-axis accelerometers in 2×2 mm packages. The tiny sensors have a quite a few features
of their own.

With full-scale ranges of ±2g/±4g/±8g/±16g, the LIS2DH and LIS2DM accelerometers include 4D/6D orientation detection and two programmable interrupt signals for motion detection, free fall and other conditions. The sensors also incorporate power saving features to improve battery life in portable applications that include power-down and sleep modes and a FIFO (first-in first-out) memory block for smarter power management.

The difference between the two sensors is the LIS2DH has more programmable sensitivity adjustments, a typical zero-g offset accuracy of ±40 mg versus ±100 mg for the LIS2DM and higher self-test output capabilities.

For more information about STMicroelectronics LIS2DH and LIS2DM triaxial accelerometers, click LIS2DH or LIS2DM.

Miniature Triaxial Accelerometer in 6.3-mm Cube

Measuring acceleration or vibration in small spaces poses problems for applications such as small component qualification, structural vibration and environmental stress screening. PCB Piezotronics, Inc., new miniature Integrated Circuit – Piezoelectric or ICP triaxial accelerometer addresses these space-constrained applications. With a 6.3 mm (0.25-in) cube form factor, the Model 356A03 delivers 10 mV/g sensitivity.

Other features of the piezoelectric sensor include a hermetic seal design with a low noise floor and high shock limit as well as a redesigned cable strain relief connection to provide improved shear and tensile strength. The CE certified 356A03 is compatible with any ICP signal conditioner or readout device that includes ICP power.

For more information about PCB Piezotronics Model 356A03 triaxial accelerometer, click here.

MEMS IMU Delivers 10-Degree-of-Freedom Capability

Today, there are several sources for six degrees of freedom (DoF) sensors. However, when 6DoF is not enough, the newest solution from Analog Devices, Inc. (ADI) may be the answer. The ADIS16488 is a 10-DoF sensor that integrates a tri-axis gyroscope, tri-axis accelerometer, tri-axis
magnetometer and a pressure sensor into a single package. Based on microelectromechanical system (MEMS) technology, the four different sensors not only fit into a 66.04x 64.77×14-mm package, they provide high performance and stability.

With bias stability of less than 10 degrees/hr), other inertial measurement unit (IMU) parameters include:

• Triaxial, digital gyroscope with digital range
  scaling,  ±450°/sec dynamic range
• Triaxial, digital accelerometer, ±18 g
• Triaxial, delta-angle and delta velocity outputs
• Triaxial, digital magnetometer, ±2.5 gauss
• Digital pressure sensor, 300 mbar to 1100 mbar

For more information about Analog Devices ADIS16488 10-degree-of-freedom sensor, click here.

Sensing Three Axes of Linear and Angular Motion in a 20-mm Footprint

There seems to be an insatiable demand to sense motion in the latest portable electronic products. For those with limited space, STMicroelectronics LSM330DL Micro-Electro-Mechanical Systems (MEMS) sensor could satisfy their requirements. In its 4 x 5 x 1mm plastic land grid array (LGA) package, the 6 degrees-of-freedom (6DoF) inertial MEMS module is almost twice as small as anything else in production according to the company.

The accelerometer portion has a user-selectable full-scale acceleration range from 2 to 16g and the gyroscope portion has angular-rate detection from 250 to 2500 dps along the pitch, roll and yaw axes. The co-packaged sensors provide inherently precise alignment of the two sensors’ reference axes. In addition, the mechanical sensing structure’s design
delivers excellent thermal and mechanical stability. For example, the angular rate sensitivity change vs. temperature
from -40 to +85°C is ±2% (typically) and angular rate sensitivity with a full scale setting of ±250 dps is typically 8.75 mdps/digit.

The 6DoF  sensor is software-compatible with ST’s latest-generation 3-axis digital accelerometers (LIS3DH) and gyroscopes (L3GD20).

For more information about STMicroelectronics LSM330DL inertial module, click here.

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