• Skip to primary navigation
  • Skip to main content
  • Skip to primary sidebar
  • Skip to footer
  • Subscribe
  • Advertise

Sensor Tips

Sensor Product News, Tips, and learning resources for the Design Engineering Professional.

  • Motion Sensing
  • Vision systems
    • Smart cameras
    • Vision software
    • Lighting
    • Optics
  • Pressure
  • Speed
  • Temperature
  • Suppliers
  • Video
    • EE Videos
    • Teardown Videos
  • EE Learning Center
    • Design Guides
    • Tech Toolboxes

Image sensors offer 106dB shutter efficiency for industrial applications

October 3, 2024 By Redding Traiger Leave a Comment

OMNIVISION has introduced three new back-side illuminated (BSI) global shutter (GS) image sensors. These sensors are designed for machine vision applications such as industrial automation, robotics, logistics barcode scanners, and intelligent transportation systems (ITS).
The new GS image sensors feature a 3.45-micron (µm) BSI pixel, which offers high sensitivity, efficient shutter performance, and strong low-light capabilities. This advanced performance in a smaller pixel allows these sensors to replace larger 4.8-µm pixel front-side illuminated (FSI) sensors commonly used in machine vision products.
Kelly Yan, staff marketing manager at OMNIVISION, noted that the company offers BSI GS sensors for the machine vision industry with 3.45-µm and 2.2-µm pixel solutions, ranging from 2- to 9-megapixel (MP) resolutions. OMNIVISION’s proprietary technologies enable improved image quality and performance in a compact design, enhancing high-speed image capture with higher SNR (Signal noise ratio) and improved accuracy.
The new sensors incorporate several advanced technologies. They feature a PureCel®Plus-S stacked-die architecture, which allows for thinner modules with effective light absorption, enhanced image quality, and a wide angular response to prevent color shading issues. The sensors also include Nyxel near-infrared (NIR) technology, which increases quantum efficiency (QE) at 700-1050nm, enabling the capture of brighter images from greater distances.
These 3.45-µm pixel sensors achieve high shutter efficiency at 106dB and offer a 20Ke- full-well capacity (FWC). This enables a higher high dynamic range (HDR) with low noise levels, resulting in clearer images. The sensors also feature on-chip dual conversion gain (DCG) HDR to extend dynamic range, producing motion artifact-free and low-noise images in challenging lighting conditions.
OMNIVISION has introduced three specific sensors for machine vision applications. The OG02C10/1B is a 2MP BSI GS sensor in a 1/2.53-inch optical format (OF) supporting 300 frames per second (fps). The OG03A10/1B is a 3MP BSI GS sensor in a 1/1.8-inch OF supporting 150 fps. The OG05C10/1B is a 5MP BSI GS sensor in a 1/1.45-inch OF supporting 120 fps.
All of these new GS sensors are compatible with standard C-mount lenses and support both LVDS and MIPI interfaces. The 3.45-µm BSI GS sensor family also includes the OG09A10, a 9MP BSI GS sensor in a 1-inch OF. The 2.2-µm BSI GS sensor family includes the OG05B1B, a 5MP resolution sensor in a 1/2.53-inch OF, and the OG01H1B, a 1.5MP resolution GS sensor in a 1/4.51-inch OF.
The OG03A10/1B and OG05C10/1B sensors are currently available for sampling and are in mass production. The OG02C10/1B sensor will be available for sampling in Q1 2025 and is expected to enter mass production in the second half of 2025.

You may also like:


  • Does TPMS need a pressure sensor?

  • What are magnetic rotary encoders?

  • What sensors are in a digit?

  • How will LiDAR sensing be used in industrial applications?

  • What are the implications of sensing as a service?

Filed Under: Image sensing, Industrial, Robotics, Sensors, Vision systems Tagged With: omnivision

Reader Interactions

Leave a Reply

You must be logged in to post a comment.

Primary Sidebar

Featured Contributions

Automotive sensor requirements for software-defined vehicles: latency, resolution, and zonal architecture

High-current, low-impedance systems need advanced current sensing technology

A2L refrigerants drive thermal drift concerns in HVAC systems

Integrating MEMS technology into next-gen vehicle safety features

Fire prevention through the Internet

More Featured Contributions

EE TECH TOOLBOX

“ee
Tech Toolbox: Connectivity
AI and high-performance computing demand interconnects that can handle massive data throughput without bottlenecks. This Tech Toolbox explores the connector technologies enabling ML systems, from high-speed board-to-board and PCIe interfaces to in-package optical interconnects and twin-axial assemblies.

EE LEARNING CENTER

EE Learning Center
“sensor
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for EE professionals.

RSS Current EDABoard.com discussions

RSS Current Electro-Tech-Online.com Discussions

  • CR2/CR123A Batteries In Projects
  • Puzzled about a relay
  • Switch Circut
  • XLR splitter to mono.
  • RC Electronic Speed Control Capacitors

EE ENGINEERING TRAINING DAYS

engineering
“bills

RSS Featured White Papers

  • 4D Imaging Radar: Sensor Supremacy For Sustained L2+ Vehicle Enablement
  • Amphenol RF solutions enable the RF & video signal chains in industrial robots
  • Implementing Position Sensors for Hazardous Areas & Safety

Footer

EE WORLD ONLINE NETWORK

  • 5G Technology World
  • EE World Online
  • Engineers Garage
  • Analog IC Tips
  • Battery Power Tips
  • Connector Tips
  • EDA Board Forums
  • Electro Tech Online Forums
  • EV Engineering
  • Microcontroller Tips
  • Power Electronic Tips
  • Test and Measurement Tips

SENSOR TIPS

  • Subscribe to our newsletter
  • Advertise with us
  • Contact us
  • About us

Copyright © 2026 · WTWH Media LLC and its licensors. All rights reserved.
The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media.

Privacy Policy