At the device level, packaging for microelectromechanical (MEMS) sensors is often performed by an outsourced assembly and test (OSAT) company. The sensors could include accelerometers, gyroscopes, magnetometers and microphones as well as pressure, temperature, infrared, biomedical, chemical and gas sensors. The first level of chip packaging formats includes cavity land grid array (LGA), molded cavity […]
What’s the status of autonomous vehicles in industrial applications? Part 1
First of all, what is an autonomous vehicle (AV)? The SAE provides classifications that many industries use for vehicular products. For automated driving, SAE has five classifications for on-road vehicles. In SAE J3016, Level 1 through Level 5 define increasing amount of automation and Level 0 designates no automation. Level 3 through Level 5 provide […]
What is the MIPI I3C sensor interface?
The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, initially released its MIPI I3C specification to its member community in January 2017. In December 2017, the Alliance announced open access to the sensor interface specification. Developed for connecting sensors to an application processor, the MIPI I3C bus interface is a core […]
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