Carlo Gavazzi announces an expansion to the successful PD30 Photoelectric Sensor family with IO-Link. This new sensor series offers the most functionality in a single photoelectric sensor on the market. Endless configurations, preventative maintenance capabilities, and special application functions provide users with high flexibility for their applications. Carlo Gavazzi is introducing four special application functions […]
Packaging
How do materials impact a sensor’s performance? Pt 1
For harsh environments, materials provide the difference between survival and failure by addressing thermal, chemical and mechanical operating requirements. However, the right materials are also essential to achieve the desired sensor electrical performance, especially in many more demanding, high performance applications. This starts with the sensing element and extends to the packaging. As one of […]
Linear position sensor is an inductive and spoiler combo
Harold G. Schaevitz Industries LLC (HGSI) has expanded its sensor product offering by adding a line of ILPS-27 Series Inductive Linear Position Sensors using LVIT Technology; contactless devices designed for factory automation and a variety of industrial or commercial applications such as motorsport vehicles, automotive testing, solar cell positioners, wind turbine prop pitch and brake […]
Contactless rotary position sensor for benchtop and test & measurement apps
NewTek Sensor Solutions offers the RV series of rotary position sensors that measure and provide feedback on the rotary displacement of rotating elements in industrial benchtop and test and measurement applications. While featuring a full 360° mechanical range, these RVDTs provide an output proportional to shaft rotation over a range of ±30° or more in […]
TE Connectivity helps improve temperature sensor accuracy with custom packaging for platinum thin film elements
Temperature sensors are one of the most widely applied measurement technologies. As technology advances and industrial processes become more complex, devices continue to require a higher level of accuracy in temperature sensing across multiple industries. TE Connectivity (TE) has been able to provide critical temperature sensing solutions for a variety of applications. In an effort […]
DLVR pressures sensors now available at Heilind Electronics
Heilind Electronics has added the manufacturer’s DLVR Series mini digital output pressure sensor to its sensor offering. The DLVR Series pressure sensors offer a fully customizable, turn-key solution for design engineers looking for a digital pressure sensing device. Product highlights include an I2C or SPI output interface with a 14-bit internal resolution, 3.3 V or […]
Leuze presents the GSX, the world’s first combined fork sensor
With the new GSX combined fork sensor, Leuze is once again introducing a worldwide innovation. This product combines the advantages of light and ultrasonic sensors. The GSX sensor is exceptionally suitable for labeling machines used in the packaging industry. With the introduction of the GSX, the world’s first combined fork sensor, Leuze is continuing its […]
How does heterogeneous integration impact sensors?
For those not familiar with the term, heterogeneous integration (HI) occurs when diverse components are assembled into System-in-Package (SiP) architectures. Late in 2019, SEMI, the global industry association representing the electronics design and manufacturing supply chain, announced the 2019 release of the Heterogeneous Integration Roadmap (HIR). Prominent examples of the roadmap are wireless and mixed […]
What application problems do newly released sensors solve?
Coping with the application environment is one of the more complex issues that sensors must address. To survive in harsh environments, sensors manufacturers improve the ruggedness of their sensors in many different ways. Three recently announced products exemplify the differences. For dusty and wet environments, Sensata Technologies ACW4 single turn and TCW4 multi-turn absolute Hall […]
How does sensor packaging adapt for challenging applications?
At the device level, packaging for microelectromechanical (MEMS) sensors is often performed by an outsourced assembly and test (OSAT) company. The sensors could include accelerometers, gyroscopes, magnetometers and microphones as well as pressure, temperature, infrared, biomedical, chemical and gas sensors. The first level of chip packaging formats includes cavity land grid array (LGA), molded cavity […]
