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Packaging

TE Connectivity helps improve temperature sensor accuracy with custom packaging for platinum thin film elements

January 5, 2021 By Redding Traiger Leave a Comment

Temperature sensors are one of the most widely applied measurement technologies. As technology advances and industrial processes become more complex, devices continue to require a higher level of accuracy in temperature sensing across multiple industries. TE Connectivity (TE) has been able to provide critical temperature sensing solutions for a variety of applications. In an effort […]

Filed Under: Development Tools, Industry Standards/Specifications, Packaging, Sensors, Temperature Tagged With: teconnectivity

DLVR pressures sensors now available at Heilind Electronics

October 22, 2020 By Redding Traiger

Heilind Electronics has added the manufacturer’s DLVR Series mini digital output pressure sensor to its sensor offering. The DLVR Series pressure sensors offer a fully customizable, turn-key solution for design engineers looking for a digital pressure sensing device. Product highlights include an I2C or SPI output interface with a 14-bit internal resolution, 3.3 V or […]

Filed Under: Industry Standards/Specifications, Machine Health, Packaging, Pressure, Pressure Sensor, Products, Sensors, Wearable sensing technologies Tagged With: heilindelectronics

Leuze presents the GSX, the world’s first combined fork sensor

October 7, 2020 By Redding Traiger

Neues-Gabelsensor-Portfolio-mit-Kombi-Gabelsensor-GSX14E-Leuze

With the new GSX combined fork sensor, Leuze is once again introducing a worldwide innovation. This product combines the advantages of light and ultrasonic sensors. The GSX sensor is exceptionally suitable for labeling machines used in the packaging industry. With the introduction of the GSX, the world’s first combined fork sensor, Leuze is continuing its […]

Filed Under: Ambient Light, Image sensing, Industry Standards/Specifications, Lighting, Packaging, Photoelectric, Sensors, Ultrasonic, Ultrasonic Level Sensor Tagged With: leuze

How does heterogeneous integration impact sensors?

March 26, 2020 By Randy Frank

For those not familiar with the term, heterogeneous integration (HI) occurs when diverse components are assembled into System-in-Package (SiP) architectures. Late in 2019, SEMI, the global industry association representing the electronics design and manufacturing supply chain, announced the 2019 release of the Heterogeneous Integration Roadmap (HIR). Prominent examples of the roadmap are wireless and mixed […]

Filed Under: Featured, Frequently Asked Question (FAQ), Inertial Measurement Unit (IMU), Packaging Tagged With: ASME, IEEE

What application problems do newly released sensors solve?

March 25, 2019 By Randy Frank

Coping with the application environment is one of the more complex issues that sensors must address. To survive in harsh environments, sensors manufacturers improve the ruggedness of their sensors in many different ways. Three recently announced products exemplify the differences. For dusty and wet environments, Sensata Technologies ACW4 single turn and TCW4 multi-turn absolute Hall […]

Filed Under: Displacement, Featured, Frequently Asked Question (FAQ), Hall Effect, Interface, Packaging, Signal Conditioning Tagged With: Kaman Measuring, Microchip Technology, Sensata Technologies

How does sensor packaging adapt for challenging applications?

February 6, 2019 By Randy Frank

At the device level, packaging for microelectromechanical (MEMS) sensors is often performed by an outsourced assembly and test (OSAT) company. The sensors could include accelerometers, gyroscopes, magnetometers and microphones as well as pressure, temperature, infrared, biomedical, chemical and gas sensors. The first level of chip packaging formats includes cavity land grid array (LGA), molded cavity […]

Filed Under: Featured, Frequently Asked Question (FAQ), Inductive, Industry Standards/Specifications, Packaging, Pressure, Pressure Sensor, Proximity Tagged With: Allen-Bradley, Amkor Technology, DunAn Sensing, Rockwell Automation

How can a core simplify pressure sensing applications?

August 16, 2018 By Randy Frank

At Sensors Expo 2018, Gary Winzeler, Vice President of Marketing & Sales for DunAn Sensing discussed the company’s new approach to specifying pressure sensors using a core approach. DunAn introduced their Ceramic Diaphragm Core (CDC) Core pressure transducer and the MEMS DURAsense Core (MDC) at Sensor Expo. Both allow pressure measurements to pumps, valves and […]

Filed Under: Featured, Frequently Asked Question (FAQ), Packaging, Pressure Sensor Tagged With: DunAn Sensing

What new materials will create new sensors?

November 28, 2017 By Randy Frank

Materials with unusual properties are a starting point for creating new sensors. A company involved in products with complex material properties and electronics possibly has an edge over its rivals when it comes to discovering or creating new sensing technologies. For example, Continental, a tire maker and automotive electronics supplier recently used electrically conductive rubber […]

Filed Under: Energy Harvesting, Featured, Frequently Asked Question (FAQ), Packaging, Pressure Sensor Tagged With: BMW, Continental

How have pressure sensors changed over the last few years?

July 14, 2017 By Randy Frank

At Sensors Expo 2017, Jim Brownell, sales manager for All Sensors, shows the progression of microelectromechanical system (MEMS) pressure sensing over the past 30+ years from his company’s perspective. Starting with the A or alpha package that was created in the early 1980s, a packaged element pressure sensor had two integral ports and six leads […]

Filed Under: Featured, Frequently Asked Question (FAQ), Packaging, Pressure Sensor, Signal Conditioning Tagged With: all sensors

What are common ways to protect a sensor from harmful exposure?

May 31, 2017 By Randy Frank

For a sensor, the amount of harmful exposure it receives from the environment and harmful constituents in the measuring process depends on what is being sensed and the environment itself. Different packaging is required to cope with and survive the specific situation. Two major considerations for protection are at the sensing element/transducer level or at […]

Filed Under: Featured, Frequently Asked Question (FAQ), Packaging Tagged With: sensor packaging

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