HBM , Inc. (www.hbm.com), introduces its FIT7A digital load cell. The FIT7A load cell not only provides nearly the same speed and accuracy of Electromagnetic Force Restoration (EFR) sensors normally found in modern packaging machines, but it does so at 60 percent less cost. This new strain gauge-based load cell makes it possible to develop […]
ON Semiconductor has successfully characterized and demonstrated its first fully-functional stacked CMOS imaging sensor featuring a smaller die footprint, higher pixel performance and better power consumption compared to traditional monolithic non-stacked designs. The technology has been successfully implemented and characterized on a test chip with 1.1-micron (µm) pixels and will be introduced in a product […]
By Mark Langridge, Director, Sales & Marketing, Packaging, Food, Beverage & Consumer Goods, SICK Inc. Faster, more capable and highly adaptable packaging machines need sensors to improve performance and reliability. Packaging machinery builders are adapting to the times and to the demands of their customers. As food, beverage, consumer products and pharmaceutical companies develop new, […]
MEMS (microelectromechanical systems) technology is used for over 90% of the pressure sensors sold today. Usually, low-cost plastic packaging is used for these sensors. To survive harsher environments more rugged stainless steel packaging and a highly durable connector are required. Setra Systems, Inc. took all of these technology aspects into account with the design of […]
The Smart Systems Integration 2014 Conference (SSI 2014) will take place in Vienna Austria on March 26-27 and address the integration issues of miniaturized systems that use microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), ICs and electronic components. At SSI 2014, over 100 internationally recognized speakers from industry-leading organizations in science and industry will provide attendees with […]
Announced at CES 2014, the InvenSense ICM-20628 system on chip (SoC) boasts the world’s highest performance and lowest power fully autonomous 6-axis motion tracking solution. The single-chip design combines industry-leading gyroscope and accelerometer specifications with InvenSense third generation digital motion processing and algorithms while consuming less than 2mW. New features of the sensor include: Self-calibration […]
In this Frank Talk about Sensors, Randy Frank talks to Valerie Rothermel-Nelson of Honeywell about a new value added program for sensors. To access the discussion, click here. For more information about the Honeywell value added program, click here.
Honeywell’s recently announced customizable pressure and thermal sensor solutions promises to shake things up. Previous customers will have to decide if they want more of the unique aspects of their system designed into the sensor. Users that did not chose Honeywell in the past must now consider the new possibilities that could make sensor design-in […]
At Sensor Expo 2013, Matt Apanius, Director of the Desich Smart Center, discusses how his organization can provide on-demand prototypes to customers. He provides an example of a health monitoring badge with a component that the Center designed, developed and built. To watch the video, click here. For more information about the Richard Desich Smart […]
In this Frank Talk About Sensors, Tim Shotter of All Sensors discusses the capabilities of a new line of low voltage, low cost digital pressure sensors with Randy Frank. To watch the video, click here. For more information about All Sensors DLVR series digital pressure sensors, click here.