With dimensions of 1.145 x 1.66 mm and a height of 0.32 mm, ams says its TSL2584TSV is the world’s thinnest ambient light sensor (ALS) with an outline and height that are approximately half the size of competing ALS devices.
Through-silicon via (TSV) package technology accounts for the small package size and improves performance by eliminating the use of wire bonds with direct connections from the device I/Os to solder balls. The Moisture Sensitivity Level-1 standard rating of the TSV package improves Humidity Temperature-Cycling performance while minimizing corrosion resistivity.
A TSL2584TSV Evaluation Kit is available.
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