• Skip to primary navigation
  • Skip to main content
  • Skip to primary sidebar
  • Skip to footer

Sensor Tips

Sensor Product News, Tips, and learning resources for the Design Engineering Professional.

  • What’s Hot
    • Development Tools
    • Energy Harvesting
    • Market Research
    • Packaging
    • Sensor Fusion
    • Sensor-specific software
    • Signal Conditioning
    • Touch Sensing
    • Wireless
  • Motion Sensing
  • Vision systems
    • Smart cameras
    • Vision software
    • Lighting
    • Optics
  • Pressure
  • Speed
  • Temperature
  • Suppliers
  • Video
  • EE Learning Center
    • Design Guides
      • WiFi & the IOT Design Guide
      • Microcontrollers Design Guide
      • State of the Art Inductors Design Guide
      • Power Electronics & Programmable Power

How does heterogeneous integration impact sensors?

March 26, 2020 By Randy Frank

For those not familiar with the term, heterogeneous integration (HI) occurs when diverse components are assembled into System-in-Package (SiP) architectures.

Late in 2019, SEMI, the global industry association representing the electronics design and manufacturing supply chain, announced the 2019 release of the Heterogeneous Integration Roadmap (HIR). Prominent examples of the roadmap are wireless and mixed signal devices, bio-chips, power devices, optoelectronics and microelectromechanical systems (MEMS) in a single package. The HIR’s scope addresses assembly & packaging, test and interconnect technologies required to meet industry needs over the next 15 years.

Chapter 11 specifically covers MEMS and Sensor Integration with the initial focus of the Technical Working Group (TWG) being inertial sensors. However, ongoing discussions for future releases involve the inclusion of optical sensors, energy harvesting for low power and different types of sensors.

Since Inertial MEMS have sensors and an application-specific IC (ASIC) for digitization of the signals combined into a single package, the packaging approach uses a mature plastic package based on organic substrates to combine the different chips. Increasing integration will mean that a greater portion of the signal path is included in the SiP as sensors become self-contained hubs and nodes.

The roadmap addresses relative performance specifications and recognizes that different applications will drive different integration paths. Identified key applications include automotive/ unmanned aerial vehicles (UAVs,) healthcare and navigation: avionics/aircraft/UAVs.

The HIR’s sponsors (the IEEE Electronics Packaging Society (EPS), SEMI, the IEEE Electron Devices Society (EDS), the IEEE Photonics Society and The American Society of Mechanical Engineers (ASME EPPD Division)) request stakeholders interested in contributing to the 2020 HIR to join the effort by visiting the roadmap’s member page.

Filed Under: Featured, Frequently Asked Question (FAQ), Inertial Measurement Unit (IMU), Packaging Tagged With: ASME, IEEE

Primary Sidebar

DesignFast

Component Selection Made Simple.

Try it Today
design fast globle

Subscribe to our Newsletter

Randy Frank delivers weekly sensor industry news, sensor resources, new sensor product innovations and more.

Subscribe Today

DESIGN GUIDE LIBRARY

“motion

EE TRAINING CENTER CLASSROOMS

EE Classrooms

RSS Current EDABoard.com discussions

  • Help designing 1.6KW Isolated AC/DC with Constant Current Output
  • Timer Counter in ATMEGA328PU is not working
  • Why don't 2 flip-flop synchronizers have a reset?
  • Regarding Induction Heating From Low Voltage DC
  • Rail-to-Rail Operational Amplifier

RSS Current Electro-Tech-Online.com Discussions

  • Circuit Problem
  • Beam Break Sensor
  • Drill speed controller fault
  • uc3843 Buck-boost
  • Right channel distortion on vintage fisher rs-2010


SensorTips Videos

RSS Featured White Papers

  • Implementing Position Sensors for Hazardous Areas & Safety
  • How New Rotary Sensor Technology Enables New Application Solutions
  • Magnetic sensor ensures safety features in depaneling machines

Footer

EE WORLD ONLINE NETWORK

  • DesignFast
  • EE World Online
  • EDA Board Forums
  • Electro Tech Online Forums
  • Microcontroller Tips
  • Analog IC Tips
  • Connector Tips
  • Power Electronic Tips
  • Test and Measurement Tips
  • Wire and Cable Tips
  • 5G Technology World

SENSOR TIPS

  • Subscribe to our newsletter
  • Advertise with us
  • Contact us
  • About us
Follow us on TwitterAdd us on FacebookFollow us on YouTube Follow us on Instagram

Copyright © 2022 · WTWH Media LLC and its licensors. All rights reserved.
The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media.

Privacy Policy