Wafer-level chip scale packaging (WLCSP) to produce 3-D packages was one of the frequent topics at the IMAPS International Conference and Exhibit on Device Packaging held March 5-8, 2012 in Scottsdale, Arizona. In addition to CMOS image sensors, MEMS (microelectromechanical system) sensors including accelerometers, gyroscopes, pressure sensors and silicon microphones are candidates for the advanced packaging technology.
Janusz Bryzek, vice-president of development, MEMS and Sensing Solutions, Fairchild Semiconductor and one of the keynote presenters on Wednesday, brought out the importance of sensors in daily life. Advanced cars have close to 100 sensors, smart homes use 10s and 100s of sensors, smart phones use six sensors and medical diagnostics use 100s of different sensors that will migrate to personal use, he noted. His summary of the packaging challenges for MEMS sensors identified stress sensitivity, media compatibility, sensitivity to moisture, vacuum packaging, die thickness, lateral wirebonding and high temperature as common issues.
For more information about the IMAPS conference, click here.