As part of IMS2015, RFIC 2015 had a plenary session keynote presentation on Monday, May18 titled, “Soft Assemblies of Radios, Sensors and Circuits for the Skin.” In his presentation, Dr. John Rogers discussed experimental and theoretical approaches for using soft materials, ultra-thin micro/nanostructures and controlled processes of mechanical buckling to achieve highly stretchable, skin like solid state systems. This could be the ultimate future of wearable electronics.
In the Tuesday, May 19 RFIC Panel, “The Internet of Things (IoT) – What’s all the Hype?…” panel members answered prepared questions and those from the audience about the future of RF technology in the IoT. The experts were:
- Ravi Subramanian, General Manager of the Analog Mixed Signal Verification Business Unit at Mentor Graphics
- Jing-Hong (Conan) Zhan, supervises MediaTek’s connectivity RF division in Hsinchu, Taiwan
- Baher Haroun, an IEEE Fellow and a Senior Fellow at Texas Instruments and director of Embedded Processing Systems Laboratory
- Larry Larson, an IEEE Fellow and Founding Dean of the School of Engineering at Brown University
- Farshid Aryanfar, a researcher at Samsung Research America, designing mm-wave radio for 5G cellular systems
- Gangadhar Burra, a Senior Director of Technology at Qualcomm Incorporated
Although RF technology was the focal point of the questions, the answers frequently involved sensing. Among the challenges discussed was the need for ultra-low power sensors nodes. An interesting observation was that the IoT is currently at the peak of the well-known hype curve.
For more information about RFIC 2015, click here.