There seems to be an insatiable demand to sense motion in the latest portable electronic products. For those with limited space, STMicroelectronics LSM330DL Micro-Electro-Mechanical Systems (MEMS) sensor could satisfy their requirements. In its 4 x 5 x 1mm plastic land grid array (LGA) package, the 6 degrees-of-freedom (6DoF) inertial MEMS module is almost twice as small as anything else in production according to the company.
The accelerometer portion has a user-selectable full-scale acceleration range from 2 to 16g and the gyroscope portion has angular-rate detection from 250 to 2500 dps along the pitch, roll and yaw axes. The co-packaged sensors provide inherently precise alignment of the two sensors’ reference axes. In addition, the mechanical sensing structure’s design
delivers excellent thermal and mechanical stability. For example, the angular rate sensitivity change vs. temperature
from -40 to +85°C is ±2% (typically) and angular rate sensitivity with a full scale setting of ±250 dps is typically 8.75 mdps/digit.
The 6DoF sensor is software-compatible with ST’s latest-generation 3-axis digital accelerometers (LIS3DH) and gyroscopes (L3GD20).
For more information about STMicroelectronics LSM330DL inertial module, click here.
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