At Sensors Expo 2019, Tom Nguyen, CEO of DunAn Sensing, explains innovative packaging for silicon microelectromechanical systems (MEMS) pressure sensor die that does not sacrifice performance. To complement its stable silicon MEMS die, DunAn Sensing is investing in packaging that takes advantage of the stability and adds flexibility without giving up performance in the package. With the MDC button package, different output can easily be provided from ratiometric to 4 to 20mA, 0 to 10 volts temperature compensated for -40°C to 150°C. With this basic packaging, different connectors can be added to the package depending on the application requirements at a much lower and affordable cost.
The MEMS pressure sensor has a total error band of ±1.0% span over a temperature range of 0°C to 80°C and ±2.0% span over a temperature range of -40°C to 150°C. The sensor is rated for a cycle life of 1 million + FS cycles, 5g vibration at 33 Hx and has the ability to pass a 1 m drop on any axis. Media compatibility includes refrigerant, hydraulic fluids and oils.
Designed for pressure sensing applications with limited space, the MDC DURAsense Core is a low-profile pressure transducer that also addresses demanding environments. The 17.04 mm sealing area for the outside of the package provides many options for additional application packaging, while the 2-mm port allows a pressure connection for a variety of applications. Overall packaging dimensions are an 18-mm diameter with a typical 7.84 mm height including the electrical connection. Products are available in pressure ranges from 0-15 to 0-750 psi in absolute, gage and sealed gage.
