Teledyne DALSA, a Teledyne Technologies company has announced its first short-wave infrared (SWIR) line scan camera for machine vision. The Linea SWIR has a cutting-edge InGaAs sensor in a compact package suitable for a variety of applications including food and packaged good inspection, recycling, mineral sorting, and solar and silicon wafer inspection.
With its responsivity and low noise, this newest Linea SWIR line scan camera allows users to see their products in a new light. Linea SWIR is a 1k resolution camera with a responsive 12.5 µm pixels, 40 kHz line rate, cycling mode, programmable I/Os, power over Ethernet (PoE), precision time protocol (PTP), and more.
“The new Linea SWIR will help customers greatly improve the quality of their output,” said Mike Grodzki, Product Manager for the new Linea SWIR. “With the ability to differentiate materials and detect moisture, Linea SWIR will allow customers to more easily identify foreign contaminants in their product stream. And its capacity to image beyond the visible spectrum makes the camera ideal for applications such as food sorting, solar wafer inspection, and consumer packaged goods inspection.”
- High responsivity low noise 1k sensor
- GigE interface
- HDR and Cycling modes
- High dynamic range
- Programmable I/Os
- Selectable 8 or 12-bit output
- Flat field correction
- ROI support