At Sensors Expo 2014, Marcellino Gemelli, director of Marketing and Business Development at Bosch Sensortec discusses the company’s BMI160, the smallest, lowest power inertial measurement unit (IMU) that uses an accelerometer and gyroscope for wearable applications. To watch the video, click here. For more information about the BMI160, click here.
It’s January 2014 and that means that the Consumer Electronics Show (CES) is happening in Las Vegas and attending companies including sensor suppliers will be announcing new products. For mobile applications, Bosch Sensortec announced the BME280 sensor that combines pressure, humidity and temperature measurement capability in a single package. An 8-pin metal-lid 2.5 x 2.5 […]
Called a development ecosystem with sensor fusion technology, Texas Instruments’ Sensor Hub BoosterPack is a plug-in daughter card for its ARM Cortex-M4 microcontroller (MCU). TivaWare software shipped with board enables measurement of pressure, humidity, ambient and infrared (IR) light along with temperature and motion (including acceleration, orientation and compass). Sensors on the board include: • […]
Augmented reality (AR), more immersive gaming, personal health and fitness, indoor navigation and other appliances requiring context awareness can take advantage of advanced motion sensing technology. At the 2013 International CES, several companies announced new products to address these applications. Bosch Sensortec describes its BNO055 as the first in a family of Application Specific Sensor […]
At the 2013 International CES, 3-axis microelectromechanical systems (MEMS) accelerometers were among the new devices that suppliers introduced to help electronics companies include new features in portable consumer electronics products. With the differentiation that MEMS technology can provide and the intense competition in the MEMS area, it is tough to achieve an industry leading milestone, […]
With the introduction and current sampling of the BMX055, Bosch Sensortec’s 9-axis (accelerometer, gyroscope and geomagnetic) sensor is the first available with all components developed and manufactured in house. The inertial measurement unit’s (IMU’s) footprint of 3.0 x 4.5 mm2 makes it the smallest on the market, too. Using the company’s FusionLib sensor fusion software […]
A Wafer-Level Chip-Scale Package (WLCSP) allows remarkably small packaging dimensions. Bosch Sensortec used WLCSP for its BMM150 triaxial magnetic field sensor and achieved a footprint of only 1.56 x 1.56 mm2 and a height of just 0.6 mm. With a height of only 0.6 mm, the sensor can be placed in the edges of the […]