Wafer-level chip scale packaging (WLCSP) to produce 3-D packages was one of the frequent topics at the IMAPS International Conference and Exhibit on Device Packaging held March 5-8, 2012 in Scottsdale, Arizona. In addition to CMOS image sensors, MEMS (microelectromechanical system) sensors including accelerometers, gyroscopes, pressure sensors and silicon microphones are candidates for the advanced […]