Matt Apanius, the director of The Richard Desich SMART Commercialization Center for Microsystems at Lorain County Community College, explains the center’s capabilities and approach to help microsystem clients to Sensor Tip’s Senior Editor, Randy Frank at Sensors Expo 2012. To watch the video, click here. For more information about The Richard Desich SMART Commercialization Center […]
Packaging
MEMS Sensors to Benefit from Advanced Packaging
Wafer-level chip scale packaging (WLCSP) to produce 3-D packages was one of the frequent topics at the IMAPS International Conference and Exhibit on Device Packaging held March 5-8, 2012 in Scottsdale, Arizona. In addition to CMOS image sensors, MEMS (microelectromechanical system) sensors including accelerometers, gyroscopes, pressure sensors and silicon microphones are candidates for the advanced […]
Using Parylene to Protect Sensors
Sensor Tip’s Randy Frank finds out the benefits of parylene coating from Tim Seifert, a market specialist at Specialty Coating Systems at Sensors Expo 2011. The thin-film coating can be used to provide a moisture, chemical and dielectric barrier to protect sensors and other electronics in medical, automotive and other applications. For more information on […]
Sensors Expo 2010 Exhibitors: Henkel Electronics
If you missed Sensors Expo or did not get a chance to check out all the exhibits, here is another of the interesting booths that I visited. Steve Saito from Henkel Electronics explains the company’s low pressure molding materials for sensors. To see the video, click the arrow link below. For more information about Henkel […]