Teledyne DALSA now sells a new Genie Nano-CXP series of cameras — a CoaXPress line of CMOS area scan cameras — that redefine performance … and feature the latest On-Semiconductor and E2V sensors.
These newest industry leading image CMOS sensors range from 16 to 67-megapixel resolution with added and proven CoaXPress 6.25 Gbps technology offering breakthrough speed, robust build quality for wide operating temperature, and an unmatched feature set at an incredible price. Perfectly complemented by the half-length Xtium-CXP frame grabber, they have been designed to work synergistically, minimizing CPU usage and improving processing times for host applications by enabling maximum sustained throughput and ready-to-use image data.
Offering 25 million pixels at 80 fps in a small form factor, these new Genie Nano-CXP cameras are engineered to deliver high-speed, dependable results for applications such as semiconductor wafer inspection, electronics manufacturing, solar panel inspection, and machine vision.
Key features of the industrial camera include:
- First four models with 16 and 25M offered in both monochrome and NIR enhanced versions
- Industry’s smallest 25M CXP cameras
- Trigger-to-Image Reliability (T2IR) framework improves the reliability of inspection system and protects from data loss
- GenICam, GenCP compliant
- Robust all-metal body with three-year warranty
For more information, visit teledynedalsa.com.
