Brewer Science, Inc. (BSI) today announced the expansion of its printed electronics program to incorporate service capabilities. These new services are categorized into three major core competencies: printing, electronics, and software The new offerings will enable customers to take full advantage of BSI’s core competencies and expertise in printed electronics sensor systems for a variety of applications.
BSI has a wide range of printing capabilities for flexible-hybrid electronics (FHE) and other printing needs. Its state-of-the-art equipment can accommodate both screen printing and spray coating. Additionally, the company can provide multilayer, front and back printing services with optical layer alignment for a variety of substrates and inks.
As the FHE market grows and enables unique applications, the ability to produce these electronic components can be challenging. BSI has partnered with customers to provide solutions for both FHE and traditional printed circuit boards (PCBs). These turn-key, integrated FHE solutions services include flexible circuit board design, layout, manufacturing, communications, firmware, and population; laser cutting and engraving; data transport and storage; device testing and consulting.