Available at the end of February 2012, Baolab Microsystems evaluation kits of its recently announced 3D NanoCompass allow users to assess the company’s NanoEMS (nano- instead of micro- electromechanical system) technology. Fabricated within the standard metal structure of a high-volume CMOS wafer process, NanoEMS enables the integration of smaller MEMS structures with microcontrollers and ASICs (application-specific ICs) simplifying system design and reducing costs. The company says this enables them to make structures an order of magnitude smaller than existing techniques for building MEMS on the surface of the wafer and also at a fraction of the cost.
For more information about Baolab Microsystems evaluation kits, click here.
