Jul
22

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Kaman-DigiVit-w-sensor2

Digital signal conditioner adapts to measuring conditions

More and more industries and manufacturers are requiring sensors for condition monitoring in their machines or processes. New digital signal conditioner technology is available that simplifies the use…

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Jul
22

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digikey

Check out These Sensor Products and Eval Boards

At Sensors Expo 2016, Bill Carrick, Director of Supplier Business Development from Digi-Key Electronics displays sensor products and evaluation boards from several suppliers that are available through his…

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Jul
21

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UofW_EH

Harvest Energy from Low Frequency Vibrations

In the Poster Contest at Sensors Expo 2016, Karim El-Rayes, a research associate at Canada’s University of Waterloo, explains a vibration energy harvesting technique with a stationary coil…

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Jul
20

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MSC-Sensor

Magnetic sensor includes LED status lights for machine monitoring

With its MSC sensor family, SIKO GmbH presents the latest stage of development in ultra-compact magnetic sensors for industry as well as machine and plant construction. Common applications…

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Jul
19

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Omron D7S Vibration Sensor

Omron electronic components to feature New D7S vibration sensor

Omron Electronic Components is pleased to announce the new D7S Vibration Sensor at the 2016 Sensors Expo & Conference in San Jose, CA, June 22-23, 2016. The D7S…

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Pressure

Sensirion_small

Measure Airflow with Pressure Sensor

Friday, July 8, 2016

At Sensors Expo 2016, Bernd Zimmerman, a field application engineer from Sensirion shows how the company’s SDP3x differential pressure sensor can be used to measure air flow in…

HK_StrainGage-Finger_LR

Printed Polymer Strain Gage Technology

Monday, June 27, 2016

Based on its patented sensor paste technology printed onto a printed circuit board (PCB), Hoffmann + Krippner’s P-DMS polymer strain gage can address a variety of applications. Potential…

Electronic-adjustment-background-small

Background suppressing sensors

Monday, May 2, 2016

In a sample application product presence needs to be verified—objects in a blister pack—before the sealing process occurs. The product and blister pack material can be various colors…

SICK’s-IMB-inductive-sensor

Solving tougher sensing requirements in industrial applications

Monday, May 2, 2016

by Randy Frank, Contributing Editor Manufacturers are tackling more difficult—and unique—design problems with the newest generation of sensors. Getting serious consideration for a design-in involves meeting all of…

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