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Allen-Bradley

How does sensor packaging adapt for challenging applications?

February 6, 2019 By Randy Frank

At the device level, packaging for microelectromechanical (MEMS) sensors is often performed by an outsourced assembly and test (OSAT) company. The sensors could include accelerometers, gyroscopes, magnetometers and microphones as well as pressure, temperature, infrared, biomedical, chemical and gas sensors. The first level of chip packaging formats includes cavity land grid array (LGA), molded cavity […]

Filed Under: Featured, Frequently Asked Question (FAQ), Inductive, Pressure, Pressure Sensor, Proximity Tagged With: Allen-Bradley, Amkor Technology, DunAn Sensing, Rockwell Automation

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