Pressure Sensor

What type of packaging exists for sensing pressure?

October 29, 2019 By Randy Frank

At Sensors Expo 2019, Tom Nguyen, CEO of DunAn Sensing, explains innovative packaging for silicon microelectromechanical systems (MEMS) pressure sensor die that does not sacrifice performance. To complement its stable silicon MEMS die, DunAn Sensing is investing in packaging that takes advantage of the stability and adds flexibility without giving up performance in the package. […]

MLDX series compensated millivolt-output pressure sensors

October 23, 2019 By Lisa Eitel

Amphenol All Sensors Corp. of Morgan Hill, Calif. now sells MLDX series pressure sensors — which are fully compatible as a drop-in replacement for Honeywell SDX series sensors. The new series offers OEM customers design flexibility and high performance over a wide temperature range … for pressure ranges from 5 inH2O to 100 PSI. The […]

Heilind Electronics adds SSI Technologies to Amphenol sensor portfolio

September 17, 2019 By Aimee Kalnoskas

Heilind Electronics has partnered with SSI Technologies (an Amphenol Company) to bring its customers a broad range of industry-leading automotive and heavy equipment sensor solutions. As an authorized distributor for SSI Technologies, Heilind will offer an extensive selection of level sensors, pressure sensors, digital gauges, speed and position sensors, and other sensing products. The company […]

How does sensor fusion improve an alarm system?

September 11, 2019 By Randy Frank

At Sensors Expo 2019, Tanja Hofner, a Principal Hardware Engineer for RF and Sensors in Infineon’s Power Management and Multimarket segment explains the operation of the company’s Integrated Alarm System demo. The demo uses two Infineon sensors: the digital XENSIV IM69D130 microelectromechanical systems (MEMS) microphone and a DPS310 digital barometric pressure sensor as well as […]

Pressure sensors feature highly accurate ceramic capacitive technology

August 12, 2019 By Aimee Kalnoskas

Heilind Electronics, an authorized distributor for Sensata Technologies, has expanded its sensor portfolio with the manufacturer’s 116CP Series pressure sensors. Highly accurate with 100 percent automated calibration, the sensors utilize field-proven ceramic capacitive technology designed for high-volume applications. 116CP Series pressure sensors are also manufactured to REACH, RoHS and CE standards. Adding to the sensors’ […]

How has low pressure sensing changed?

June 28, 2019 By Randy Frank

At Sensors Expo 2019 in San Jose, CA, Jim Brownell, sales manager for All Sensors, explains how All Sensors fits into Amphenol Corporation since it was acquired last year. As one of the twelve companies in Amphenol’s Advanced Sensing Group, All Sensors continues its focus on low pressure sensing applications. Low pressure for microelectromechanical […]

How can system designers integrate sensors quicker?

May 19, 2019 By Randy Frank

To make designing with the sensor easier, best practices and guidelines compiled by the application experts at the sensor manufacturer and other tools can simplify user’s implementation and avoid pitfalls that have been observed in previous system designs. This is certainly true for sensors (transducers) that convert mechanical forces to electrical signals and have mechanical […]

Pressure sensor designed for extended temperature applications

May 13, 2019 By Aimee Kalnoskas

Bourns, Inc. further expanded its line of environmental sensors to include a new pressure sensor. Bourns Model BPS140 pressure sensors are based on state-of-the-art Microelectromechanical Systems (MEMS) technology, which provides extremely accurate condition readings in a miniature package size. Designed to deliver high sensitivity/accuracy and long-term reliability, the new BPS140 pressure sensors offer extended temperature capability and certain […]

New pressure transducer provides digital communication

May 9, 2019 By Paul Heney

The new KD41 pressure transducer combines the rugged and reliable Ashcroft sensor with industry standard CANbus protocol to provide state-of-the-art digital communication. Available in CANopen 2.0A, CANopen 2.0B and CAN SAE J1939, this versatile transducer is designed to meet the requirements of a wide variety of OEM applications. The stainless steel KD41 is available in […]

How does sensor packaging adapt for challenging applications?

February 6, 2019 By Randy Frank

At the device level, packaging for microelectromechanical (MEMS) sensors is often performed by an outsourced assembly and test (OSAT) company. The sensors could include accelerometers, gyroscopes, magnetometers and microphones as well as pressure, temperature, infrared, biomedical, chemical and gas sensors. The first level of chip packaging formats includes cavity land grid array (LGA), molded cavity […]