At Sensors Expo 2019 in San Jose, CA, Jim Brownell, sales manager for All Sensors, explains how All Sensors fits into Amphenol Corporation since it was acquired last year. As one of the twelve companies in Amphenol’s Advanced Sensing Group, All Sensors continues its focus on low pressure sensing applications. Low pressure for microelectromechanical […]
How can system designers integrate sensors quicker?
To make designing with the sensor easier, best practices and guidelines compiled by the application experts at the sensor manufacturer and other tools can simplify user’s implementation and avoid pitfalls that have been observed in previous system designs. This is certainly true for sensors (transducers) that convert mechanical forces to electrical signals and have mechanical […]
Pressure sensor designed for extended temperature applications
Bourns, Inc. further expanded its line of environmental sensors to include a new pressure sensor. Bourns Model BPS140 pressure sensors are based on state-of-the-art Microelectromechanical Systems (MEMS) technology, which provides extremely accurate condition readings in a miniature package size. Designed to deliver high sensitivity/accuracy and long-term reliability, the new BPS140 pressure sensors offer extended temperature capability and certain […]
New pressure transducer provides digital communication
The new KD41 pressure transducer combines the rugged and reliable Ashcroft sensor with industry standard CANbus protocol to provide state-of-the-art digital communication. Available in CANopen 2.0A, CANopen 2.0B and CAN SAE J1939, this versatile transducer is designed to meet the requirements of a wide variety of OEM applications. The stainless steel KD41 is available in […]
How does sensor packaging adapt for challenging applications?
At the device level, packaging for microelectromechanical (MEMS) sensors is often performed by an outsourced assembly and test (OSAT) company. The sensors could include accelerometers, gyroscopes, magnetometers and microphones as well as pressure, temperature, infrared, biomedical, chemical and gas sensors. The first level of chip packaging formats includes cavity land grid array (LGA), molded cavity […]
Pressure sensors designed for durability in harsh environments at a cost-effective price point
LORD Sensing, Stellar Technology announces the new “EVO” design platform-driven LS Series pressure transducers and transmitters. Designed to provide unlimited combinations of configurations without sacrificing performance and reliability, LORD Sensing now offers a turnaround of 4 weeks or less with the new LS Series product line. Today’s pressure sensors need a broad range of flexibility in […]
How can a sensor company successfully integrate with an acquiring larger electronics company?
The acquisition of successful microelectromechanical systems (MEMS) sensor companies by larger and broader semiconductor manufacturers and even other larger sensor suppliers has occurred frequently within the past few years. While there are numerous post-acquisition steps that need to be taken to successfully integrate the two companies, a co-development project is technical way to demonstrate the […]
All Sensors adds pressure ranges to its compact sensor series
All Sensors Corporation of Morgan Hill, California has announced the availability of additional BLC Series pressure ranges. The BLC Series now includes high pressure ranges from 5 psi to 150 psi. This device series offers design engineers excellent performance for pressure ranges of ±1 inH2O through ±30 inH2O, and now 5 psi to 150 psi […]
What can you do with a water-resistant pressure sensor?
At Sensors Expo 2018, a product marketing engineer for ST Microelectronics demonstrates how a water-resistant pressure sensor mounted on a printed circuit board (PCB) can be submerged in water and provide accurate readings. With this capability, it has potential applications in wearable devices, altimeters and barometers for portable devices, GPS applications, weather station equipment, Industry […]
How can sensing be distributed in a smart building?
At Sensors Expo 2018, Masakazu Shiinoki, a field application engineer from the MEMS Sensor Business Unit of Omron shows how different microelectromechanical systems (MEMS) sensing technologies can be used in a building. The three (ground, first and second) floors use barometric (absolute pressure), airflow and differential pressure sensors. In addition, the first floor has an […]
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