Heilind Electronics has partnered with SSI Technologies (an Amphenol Company) to bring its customers a broad range of industry-leading automotive and heavy equipment sensor solutions. As an authorized distributor for SSI Technologies, Heilind will offer an extensive selection of level sensors, pressure sensors, digital gauges, speed and position sensors, and other sensing products. The company […]
How does sensor fusion improve an alarm system?
At Sensors Expo 2019, Tanja Hofner, a Principal Hardware Engineer for RF and Sensors in Infineon’s Power Management and Multimarket segment explains the operation of the company’s Integrated Alarm System demo. The demo uses two Infineon sensors: the digital XENSIV IM69D130 microelectromechanical systems (MEMS) microphone and a DPS310 digital barometric pressure sensor as well as […]
Pressure sensors feature highly accurate ceramic capacitive technology
Heilind Electronics, an authorized distributor for Sensata Technologies, has expanded its sensor portfolio with the manufacturer’s 116CP Series pressure sensors. Highly accurate with 100 percent automated calibration, the sensors utilize field-proven ceramic capacitive technology designed for high-volume applications. 116CP Series pressure sensors are also manufactured to REACH, RoHS and CE standards. Adding to the sensors’ […]
How has low pressure sensing changed?
At Sensors Expo 2019 in San Jose, CA, Jim Brownell, sales manager for All Sensors, explains how All Sensors fits into Amphenol Corporation since it was acquired last year. As one of the twelve companies in Amphenol’s Advanced Sensing Group, All Sensors continues its focus on low pressure sensing applications. Low pressure for microelectromechanical […]
How can system designers integrate sensors quicker?
To make designing with the sensor easier, best practices and guidelines compiled by the application experts at the sensor manufacturer and other tools can simplify user’s implementation and avoid pitfalls that have been observed in previous system designs. This is certainly true for sensors (transducers) that convert mechanical forces to electrical signals and have mechanical […]
Pressure sensor designed for extended temperature applications
Bourns, Inc. further expanded its line of environmental sensors to include a new pressure sensor. Bourns Model BPS140 pressure sensors are based on state-of-the-art Microelectromechanical Systems (MEMS) technology, which provides extremely accurate condition readings in a miniature package size. Designed to deliver high sensitivity/accuracy and long-term reliability, the new BPS140 pressure sensors offer extended temperature capability and certain […]
New pressure transducer provides digital communication
The new KD41 pressure transducer combines the rugged and reliable Ashcroft sensor with industry standard CANbus protocol to provide state-of-the-art digital communication. Available in CANopen 2.0A, CANopen 2.0B and CAN SAE J1939, this versatile transducer is designed to meet the requirements of a wide variety of OEM applications. The stainless steel KD41 is available in […]
How does sensor packaging adapt for challenging applications?
At the device level, packaging for microelectromechanical (MEMS) sensors is often performed by an outsourced assembly and test (OSAT) company. The sensors could include accelerometers, gyroscopes, magnetometers and microphones as well as pressure, temperature, infrared, biomedical, chemical and gas sensors. The first level of chip packaging formats includes cavity land grid array (LGA), molded cavity […]
Pressure sensors designed for durability in harsh environments at a cost-effective price point
LORD Sensing, Stellar Technology announces the new “EVO” design platform-driven LS Series pressure transducers and transmitters. Designed to provide unlimited combinations of configurations without sacrificing performance and reliability, LORD Sensing now offers a turnaround of 4 weeks or less with the new LS Series product line. Today’s pressure sensors need a broad range of flexibility in […]
How can a sensor company successfully integrate with an acquiring larger electronics company?
The acquisition of successful microelectromechanical systems (MEMS) sensor companies by larger and broader semiconductor manufacturers and even other larger sensor suppliers has occurred frequently within the past few years. While there are numerous post-acquisition steps that need to be taken to successfully integrate the two companies, a co-development project is technical way to demonstrate the […]
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